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| MBRS3200T3 Surface Mount Schottky Power Rectifier This device employs the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. Features http://onsemi.com * * * * * * * Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Very High Blocking Voltage - 200 V 150C Operating Junction Temperature Guard-Ring for Stress Protection Pb-Free Package is Available SCHOTTKY BARRIER RECTIFIER 3.0 AMPERE 200 VOLTS Mechanical Charactersistics * Case: Epoxy, Molded, Epoxy Meets UL 94, V-0 * Weight: 95 mg (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * * * * Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Cathode Polarity Band Device Meets MSL 1 Requirements ESD Ratings: Machine Model = A ESD Ratings: Human Body Model = 1C SMB CASE 403A PLASTIC MARKING DIAGRAM AYWW B320G G MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (TL = 120 C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction Temperature Symbol VRRM VRWM VR IF(AV) IFSM Value 200 Unit V B320 = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) 3.0 100 A A ORDERING INFORMATION Device MBRS3200T3 Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel TJ -65 to +150 C MBRS3200T3G Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2005 1 August, 2005 - Rev. 3 Publication Order Number: MBRS3200T3/D MBRS3200T3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Lead (Note 1) Thermal Resistance, Junction-to-Ambient (Note 2) Symbol RqJL RqJA Value 13 62 Unit C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3) (IF = 3.0 A, TJ = 25C) (IF = 4.0 A, TJ = 25C) (IF = 3.0 A, TJ = 150C) Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 150C) 1. Minimum pad size (0.108 x 0.085 inch) for each lead on FR4 board. 2. 1 inch square pad size (1 x 0.5 inch) for each lead on FR4 board. 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. VF 0.84 0.86 0.59 IR 1.0 5.0 mA mA V 100 TC = 100C IF, FORWARD CURRENT (A) IF, FORWARD CURRENT (A) 100 TC = 100C TC = 150C 10 TC = 150C TC = 25C 10 TC = 25C 1 1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 VF, INSTANTANEOUS VOLTAGE (V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 VF, INSTANTANEOUS VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage TC = 150C IR, REVERSE CURRENT (A) 1.0E-04 1.0E-05 1.0E-06 1.0E-07 1.0E-08 TC = 25C 20 40 60 80 100 TC = 100C IR, MAXIMUM REVERSE CURRENT (A) 1.0E-03 1.0E-01 1.0E-02 TC = 150C 1.0E-03 TC = 25C 1.0E-04 1.0E-05 1.0E-09 0 120 140 160 180 200 1.0E-06 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 MBRS3200T3 1000 TC = 25C f = 1 MHz Typical Capacitance at 0 V = 209 V 100 IF, AVERAGE FORWARD CURRENT (A) 7 6 dc 5 SQUARE WAVE 4 3 2 1 0 80 90 100 110 120 130 140 150 160 TL, LEAD TEMPERATURE (C) C, CAPACITANCE (pF) 10 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) Figure 5. Typical Capacitance Figure 6. Current Derating - Lead Pfo, AVERAGE POWER DISSIPATION (W) 5 4.5 4 3.5 dc 3 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 IO, AVERAGE FORWARD CURRENT (A) SQUARE WAVE Figure 7. Forward Power Dissipation http://onsemi.com 3 MBRS3200T3 PACKAGE DIMENSIONS SMB PLASTIC PACKAGE CASE 403A-03 ISSUE E HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.41 0.10 0.15 2.03 2.11 0.23 0.30 3.56 3.81 4.32 4.57 5.44 5.59 1.02 1.27 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.095 0.006 0.083 0.012 0.150 0.180 0.220 0.050 b D A L L1 c A1 SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 MBRS3200T3/D |
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